JPH0414858B2 - - Google Patents

Info

Publication number
JPH0414858B2
JPH0414858B2 JP61273121A JP27312186A JPH0414858B2 JP H0414858 B2 JPH0414858 B2 JP H0414858B2 JP 61273121 A JP61273121 A JP 61273121A JP 27312186 A JP27312186 A JP 27312186A JP H0414858 B2 JPH0414858 B2 JP H0414858B2
Authority
JP
Japan
Prior art keywords
molding
mold
molding die
resin
molded article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61273121A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63126712A (ja
Inventor
Shunji Fujimura
Tsuneyuki Yamanaka
Fujio Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissha Printing Co Ltd
Original Assignee
Nissha Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co Ltd filed Critical Nissha Printing Co Ltd
Priority to JP27312186A priority Critical patent/JPS63126712A/ja
Priority to DE3689772T priority patent/DE3689772T2/de
Priority to PCT/JP1986/000654 priority patent/WO1987004315A1/ja
Priority to EP87900284A priority patent/EP0253892B1/en
Publication of JPS63126712A publication Critical patent/JPS63126712A/ja
Publication of JPH0414858B2 publication Critical patent/JPH0414858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14827—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using a transfer foil detachable from the insert
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP27312186A 1985-12-28 1986-11-17 成形同時加飾物品の製造法 Granted JPS63126712A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP27312186A JPS63126712A (ja) 1986-11-17 1986-11-17 成形同時加飾物品の製造法
DE3689772T DE3689772T2 (de) 1985-12-28 1986-12-26 Übertragungsmaterial für gedruckte leiterplatte, sowie vorbereitete gedruckte leiterplatte zur verwendung dieses übertragungsmaterials und verfahren zur herstellung.
PCT/JP1986/000654 WO1987004315A1 (fr) 1985-12-28 1986-12-26 Materiau de transfert pour carte de circuit imprime, carte de circuit imprime preparee en utilisant ledit materiau de transfert et procede de preparation
EP87900284A EP0253892B1 (en) 1985-12-28 1987-07-21 Transfer material for printed circuit board and printed circuit board prepared using said transfer material and process for preparation thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27312186A JPS63126712A (ja) 1986-11-17 1986-11-17 成形同時加飾物品の製造法

Publications (2)

Publication Number Publication Date
JPS63126712A JPS63126712A (ja) 1988-05-30
JPH0414858B2 true JPH0414858B2 (en]) 1992-03-16

Family

ID=17523421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27312186A Granted JPS63126712A (ja) 1985-12-28 1986-11-17 成形同時加飾物品の製造法

Country Status (1)

Country Link
JP (1) JPS63126712A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08336860A (ja) * 1995-06-14 1996-12-24 Idemitsu Petrochem Co Ltd 部分積層成形品の製造方法、金型、および、製造装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0531755A (ja) * 1991-07-17 1993-02-09 Kouno Plast Kogyo Kk 加飾フイルムを表面加工した三次元成形物の製造方法
JP3379546B2 (ja) * 1993-04-13 2003-02-24 三菱瓦斯化学株式会社 模様入り成形品の製造方法
JP5442927B2 (ja) * 2006-08-18 2014-03-19 Ｓａｂｉｃイノベーティブプラスチックスジャパン合同会社 多層成形品を製造する成形法
US9908272B2 (en) * 2013-03-12 2018-03-06 Sabic Global Technologies B.V. Thin wall application with injection compression molding and in-mold roller

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60212312A (ja) * 1984-04-06 1985-10-24 Toyota Motor Corp 積層成形品の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08336860A (ja) * 1995-06-14 1996-12-24 Idemitsu Petrochem Co Ltd 部分積層成形品の製造方法、金型、および、製造装置

Also Published As

Publication number Publication date
JPS63126712A (ja) 1988-05-30

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